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Figure 6.6 illustrates the scheme for a an 8-bit digital input port using an 8-bit parallel-in, serial-out shift register. This expansion scheme requires 3 I/O pins, and for the cost of 3 I/O pins, you get 8 input-only pins. The 74165 has 5 control lines: serial-in to cascade multiple shift registers, Qout, which is the shift register output, Clock Inhibit to disable clocking of the shift register, Shift/Load*, that is used to capture the input data and shift it out through the Qout pin, and the Clock input pin.

machines, or repair equipment N2 is particularly effective when working with no-clean solder pastes or fluxes and it will gain increased importance with the conversion to Pb-free soldering Most all of the Pb-free solders that are in widespread use for the electronics industry are slower to wet and require greater reflow temperatures than the old Sn/Pb standard The introduction of nitrogen limits further oxidation of the metals to be joined, the solder, and even the flux This in turn increases fluxing effectiveness and enhances solder wetting Also, several of the Pb-free soldering alloys are prone to oxidation, such as solders containing Bi, Zn, or In Reduced dross (oxides on top of liquid solder) production rates are generally seen when nitrogen is used to limit the oxygen content of the wave soldering atmosphere Numerous citations have indicated that soldering can be effectively augmented by the use of an inert environment 46.

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812 Use of N2 for Lighter, More Transparent No-Clean Residue The yellow or brown coloration of some no-clean residues is absent when boards are soldered in a nitrogen atmosphere Clearer no-clean residues make for easier inspection of solder joints on finished PCAs It should be noted that the use of nitrogen even keeps the PWB laminate coloration looking the same as before it went through the soldering process 46813 Nitrogen Negatives There are some negative points that must be considered when working with N2 468131 Cost There are some negative points that must be considered when working with N2 First and foremost, nitrogen is an added expense for manufacturing For factory usage, it is impractical and dangerous to store large numbers of gaseous cylinders or liquid dewars onsite; for this reason, bulk storage is needed.

This comes with facility capital costs including: cement pad for outside storage tank and vaporizers to convert stored liquid N2 into usable room temperature gas Pressure regulation is needed as well as piping and further pressure regulation for delivery of nitrogen to the soldering equipment Then there is the incremental cost of nitrogen usage 468132 Tombstoning It has been found that even modest flows of N2 are beneficial However, too much nitrogen during reflow leads to passive component tombstoning (see Fig 466)..

FIGURE 46.6 Passive component exhibiting tombstoning. Differential heating and surface tension effects have drawn the lightweight chip away from the surface of the PWB during reflow. On solidification, the component is frozen in the raised position and an open circuit results.

Normally satisfactory, but attention to sealing is necessary, except where a process liquid can be used as a lubricant

During reflow, solder may wet to one end of a chip before the other, usually due to one bonding pad heating before the other. As the solder continues to wet around the one end, the surface tension of the molten solder on that wetted end results in a lifting of the chip off the board before the solder paste goes molten and wets the opposite end. This results in an open solder joint. This defect, sometimes referred to as the Manhattan Effect, standing proud, or drawbridging, is most often seen on the smallest passive devices. The defect is exacerbated by excessive oven atmosphere inerting. Oxygen monitors can be used to sense the amount of nitrogen in an oven. Maintaining a reflow oven oxygen concentration level of about 1,000 ppm to 1,500 ppm O2 will benefit reflow and minimize tombstoning. Inerting to this level is also significantly more economical since nitrogen consumption is less than when running at lower O2 concentrations.

Fluxless Soldering There have been many discussions and investigations into fluxless soldering, but often this term is incorrectly applied. Disruption of the integrity of oxides on the parts to be soldered and on the solder itself is a requirement for solder wetting. If a thermal or thermomechanical method is solely employed (e.g., as by ultrasonics), then it is truly a fluxless method. If a chemical agent is applied for oxide removal, whether it is in solid, liquid, or gaseous phase, it is still a flux-based process. Using cover gases alone does nothing to clean oxidized leads, bonding pads, or solder, but will limit further oxidation.

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