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Although no-clean residues after soldering are generally benign, care must be taken to minimize the flux dispensed during board repair There is a chance that the pooled flux will not be.

To get the timing intervals, the AVR processor can use the Timer0 timer, which is available in all the AVR processors The software-driven data transmission and reception routine that is included on the CD in fact interfaces directly to the RS-232 port without using any MAX232 type of line converters The level conversion from RS-232 level to TTL is performed with a few resistors and diodes The signal inversion is performed in software For transmission, the TTL data can be directly put on a RS-232 line, and the PC will receive it correctly (the data must be inverted in logic, though) A working example of this approach is illustrated in a later chapter, and the circuit diagram is illustrated in Figure 177 Serial driver (bit-banging method) test code for Figure 177 is available in the code directory in file ser_drvasm..

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FIGURE 46.5 ICT probe noncontact: (a) If there is flux on a test pad, it will harden after soldering and may prevent the test probe from making electrical contact to the test pad. The test result may be interpreted as an open circuit. (b) As the board is fluxed in preparation for the wave solder process, the liquid flux may be drawn by capillary action between the wave solder pallet and the PWB. When this occurs, the in-circuit test pad (the target for bed-of-nails testing) may become fouled with solder flux. The flux residue inhibits probe contact.

fully heated and divested of its organic acids (activators). If this happens, the flux will remain acidic and promote corrosion. Therefore, it is important to ensure that:

Lubricant may impose limitations Self-contained assemblies can be used with Excellent with certain limits of Auxiliary high self-contained pressure is load, speed, grease or oil and diameter; necessary lubricant beyond this, oil circulation is necessary Excellent Good

The smallest amount of flux is used for a repair Flux is confined to the area, that is, the lead(s) to be repaired The use of liquid fluxes is avoided, as they are prone to spreading The smallest diameter flux-core solder wire is used for repairs Ultra-fine, electrostatic discharge (ESD) safe, felt-tip flux pens or paste flux is applied with an ultra-fine artist s brush, fine pick, or pin All the flux dispensed has reached a near soldering temperature

Several general issues regarding fluxes must be considered before selecting one for a process and product.

Solder Paste Misprint Cleaning When solder paste is printed in a manufacturing setting, occasionally the paste deposit is misprinted or smeared, requiring that it be removed before reprinting. Although this is not truly a fluxing issue, it does have ramifications to the process and reliability and is an important flux chemistry related topic. Here are some guidelines for accomplishing this.

Aqueous-Clean Solder Paste Misprint Cleaning A standard aqueous board cleaner or an aqueous stencil washer can be used for solder paste removal. Here are some simple guidelines:

(Contd )

Figure 6.5 Timing the RS-232 signal. The first bit is the Start bit and the last bit is the Stop bit.

Ensure that all parts on the board are compatible with aqueous cleaning Some surfacemount switches may not be compatible and may need to be removed from the board or masked in some way to prevent water or flux residue leakage If SMD placement has begun, remove any high-value components from the paste on the side that is misprinted or smudged Do not wipe solder paste off the board, as this will force paste into vias, PTHs, and solder mask clearance areas Once reflowed, any solder residues may interfere with PTH component insertion or press-fit operations If tape is used to mask gold fingers or other features, remove it before the commencing misprint cleaning to avoid entrapping solder beads or paste residue beneath the tape.

Allow the paste to wash off during the aqueous cleaning process using a standard aqueous cleaning machine or an aqueous-based stencil washing machine Direct immersion of the board should be avoided Immersion may result in water and diluted flux residues leaking into already mounted switches even into switches that are specified as hermetically sealed and water-wash compatible Do not use solvents other than water to clean the board Do not use a saponifer or solvent other than water unless the flux chemistry has been tested and qualified for compatibility and unless saponification or other solvent is in use with standard post-solder board cleaning Do not use ultrasonic cleaners Even random-frequency/random-amplitude ultrasonic cleaners may impact certain devices that may be already mounted on the board (eg, on the secondary side) Crystal oscillators are notoriously sensitive to ultrasonic cleaning.

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